MBD-X11SPi-TF 2nd Generation Intel® Xeon® Scalable X11 Motherboard

Key Features

• 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W
• Intel® C622
• Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
• Expansion slots:
• 1 PCI-E 3.0 x16,
• 1 PCI-E 3.0 x16 (x16 || x8),
• 1 PCI-E 3.0 x8 (x0 || x8),
• 1 PCI-E 3.0 x8,
• 1 PCI-E 3.0 x4 (in x8)
• 2 10GbE LAN ports
• 10 SATA3 (6Gbps) via C622
• I/O: 1 VGA, 2 COM, TPM header
• 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
• M.2 NGFF connector
• M.2 Interface: PCI-E 3.0 x4 and SATA
• Form Factor: 2280, 22110
• Key: M-Key
• Double Height Connector