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  • MBD-X11SPi-TF

MBD-X11SPi-TF 2nd Generation Intel® Xeon® Scalable X11 Motherboard

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors, Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

SKU:

MBD-X11SPi-TF

Weight:
0 lbs
Shipping:
Ships within 8-10 Days
Price:

$503.58

$419.65

Availability In stock

FREE SHIPPING AVAILABLE

Overview

Key Features

  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors., Single Socket P (LGA 3647) supported, CPU TDP support 205W
  • Intel® C622
  • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
  • Expansion slots:
  • 1 PCI-E 3.0 x16,
  • 1 PCI-E 3.0 x16 (x16 || x8),
  • 1 PCI-E 3.0 x8 (x0 || x8),
  • 1 PCI-E 3.0 x8,
  • 1 PCI-E 3.0 x4 (in x8)
  • 2 10GbE LAN ports
  • 10 SATA3 (6Gbps) via C622
  • I/O: 1 VGA, 2 COM, TPM header
  • 5 USB 3.0 (2 rear, 1 Type-A, 2 via header), 6 USB 2.0 (2 rear, 4 via headers)
  • M.2 NGFF connector
  • M.2 Interface: PCI-E 3.0 x4 and SATA
  • Form Factor: 2280, 22110
  • Key: M-Key
  • Double Height Connector

Technical Specification

Product SKUs
MBD-X11SPi-TF
  • X11SPi-TF
 
Physical Stats
Form Factor
  • ATX
Dimensions
  • 12" x 9.6" (30.48cm x 24.38cm)
 
Processor/Cache
CPU
  • 2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Intel® Xeon® Scalable Processors.
  • Single Socket P (LGA 3647) supported, CPU TDP support 205W
Cores / Cache
  • Up to 28 cores
Note
  • BIOS version 3.0a or above is required to support 2nd Generation Intel Xeon Scalable Processors-SP
 
System Memory
Memory Capacity
  • Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots
Memory Type
  • 2933/2666/2400/2133MHz ECC DDR4 RDIMM, LRDIMM
DIMM Sizes
  • RDIMM: 8GB, 16GB, 32GB, 64GB
  • LRDIMM: 32GB, 64GB, 128GB
  • 3DS LRDIMM: 64GB, 128GB, 256GB
Memory Voltage
  • 1.2V
Error Detection
  • Corrects single-bit errors
 
On-Board Devices
Chipset
  • Intel® C622
SATA
  • Intel® C622 controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
IPMI
  • ASPEED AST2500
Network Controllers
  • Dual LAN with 10GBase-T with Intel® X722 + X557
Graphics
  • Aspeed AST2500 BMC
 
Input / Output
SATA
  • 10 SATA3 (6Gbps) port
LAN
  • 2 RJ45 10GBase-T ports
USB
  • 6 USB 2.0 ports (2 rear + 4 headers)
  • 5 USB 3.0 ports (2 rear + 2 headers + 1 Type A)
Video Output
  • 1 VGA port
Serial Port / Header
  • 2 COM Ports (1 rear, 1 header)
TPM
  • TPM Header
Expansion Slots
PCI-E
  • 1 PCI-E 3.0 x16,
  • 1 PCI-E 3.0 x16 (x16 or x8 ),
  • 1 PCI-E 3.0 x8 (x0 or x8 ),
  • 1 PCI-E 3.0 x8,
  • 1 PCI-E 3.0 x4 (in x8 slot)
M.2
  • M.2 Interface: PCI-E 3.0 x4 and SATA
  • Form Factor: 2280, 22110
  • Key: M-Key
  • Double Height Connector
 
System BIOS
BIOS Type
  • AMI UEFI
BIOS Features
  • ACPI 6.0
  • RTC (Real Time Clock) Wakeup
  • SMBIOS 3.0 or later
 
Management
Software
  • Intel® Node Manager, IPMI2.0, KVM with dedicated LAN, NMI, SPM, SUM, SuperDoctor® 5, Watchdog
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
 
PC Health Monitoring
Voltage
  • +1.8V, +12V, +3.3V, +5V, +5V standby, 3.3V standby, 7-fan status, Chassis intrusion header, HT, Monitors CPU voltages, Supports system management utility, VBAT
FAN
  • 7x 4-pin fan headers (up to 7 fans), Fan speed control, Overheat LED indication, PWM fan speed control, System level control
Temperature
  • CPU thermal trip support, PECI
LED
  • CPU / System Overheat LED, UID/Remote UID, Suspend static indicator LED
Other Features
  • ACPI power management, Control of power-on for recovery from AC power loss, CPU thermal trip support for processor protection, M.2 NGFF connector, RoHS, UID, WOL
 
Operating Environment
Operating Temperature Range
  • 0°C ~ 50°C (32°F ~ 122°F)
Non-Operating Temperature Range
  • -40°C - 70°C (-40°F - 158°F)
Operating Relative Humidity Range
  • 8% - 90% (non-condensing)
Non-Operating Relative Humidity Range
  • 5% - 95% (non-condensing) 

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